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HyComp has over 20 years experience working with high
temperature composites. Our customer commitment is to provide full product development assistance including concurrent part design, prototype molding and production molding of high performance thermoplastics. Our extensive machining capabilities and facilities allows us the option of machining prototype parts from stock shapes while finalizing molded part design or while production tooling is being built.
HyComp manufactures custom compression and transfer molded thermoset parts for various industries. Our advanced equipment in this area allows us to mold a wide variety of custom shapes, stock plates, and custom bushings. We have a full range of machines from 25-500 tons with temperature process capabilities exceeding 700°F. Our transfer molding capabilities allow us to provide our customers even greater part design flexibility allowing for greater detail and more near net features in their part design. HyComp routinely performs over molding and insert molding in today's most advanced materials.
HyComp's speciality is in high temperature polymers featuring several proprietary grades of composites. HyComp's materials, WearComp®, WearComp® 200, FibreComp®,
and H310® were developed for high-temperature/ high-performance self-lubricating bearings, wear items and H320® for thermal/electrical insulators. These materials represent the best possible solution high
-performance long-life bearing applications. The materials feature high temperature resistance up to 600°F, low coefficients of friction, high compressive and impact strength, excellent chemical resistance, and unique self-lubricating properties.
HyComp has a full service mold design and a tool room dedicated to producing prototype or production tooling. We have extensive knowledge in designing multi-cavity tooling for transfer molded parts in a wide variety of thermoset materials.
We routinely mold parts from materials commercially available from Quantum Composites, Cytec Engineered Materials, Henkel, Sumitomo, and IDI. |
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